电动汽车电机控制器集成度较高，设计空间有限，并且为了保证可靠性，许多控制器不能使用风扇对大功率芯片进行降温。因此，为了降低电动汽车电机控制器内大功率芯片的温度，需要对电机控制器结构进行优化设计。通过3种方案来进行优化：首先，通过改变芯片的纵向布置改变芯片周围流场；然后，通过改变控制板结构来改变芯片周围的流场；最后，通过设置冷端导热结构对芯片进行散热。将几种方法的分析结果对比进而得到可以有效降低大功率芯片温度的最佳控制器结构优化方案，优化结果为电机控制器散热设计提供了理论指导。

Due to the compact layout, the design space for motor controller in electric vehicle is limited. Besides, fan cooling is forbidden in some cases to ensure the reliability of the motor controller and the highpower chips. In order to decrease the temperature of highpower chips in motor controller, structural optimizations are carried out. Firstly, layout of the chips is rearranged to change the surrounding flow field. Secondly, structure of the printed circuit board (PCB) is changed to alter the flow field. Finally, the cold end heat conduction structure is used to cool the chips. The optimization measures are verified by simulation. The optimization results can provide theoretical guidance for the heat dissipation design of the motor controller.

国家重点研发计划项目(2018YFB0104501)