2021, 48(2):57-63.
DOI: 10.12177/emca.2020.203
Abstract:
According to the characteristics of high temperature (about 200 ℃) of electromagnetic mechanism for high temperature valve (EM-HTV), firstly, the electromagnetic field loss distribution and temperature field distribution of EM-HTV are studied by using electromagnetic field and temperature field analysis method. Then, a novel structure of "coil grading with interstage heat conduction ring and shell cooling plate" is proposed. Based on the principle of orthogonal experiment, the key dimensions of the proposed structure are optimized. The existing electromagnetic mechanism is improved, and the new structure is verified by temperature rise test. The error between the test data and the simulation data is within a reasonable range, which proves the feasibility of applying the electromagnetic field and temperature field analysis method to the coil temperature rise analysis. Finally, the temperature distribution of the high temperature electromagnetic drive mechanism of the new structure is studied, and it is found that the maximum temperature decreases from 278.29 ℃ by about 13.32% to 241.23 ℃, and the low temperature area increases obviously, which can meet the requirement of reliable operation temperature rise. In addition, the proposed structure has the advantages of convenient winding and easy troubleshooting, modular processing and modification of existing products.